Crystalline Photovoltaic

Different high effiency wafer based cell technologies are available in high volume manufacturing. Manufacturing costs are crucial for cells and modules. For achieving highest efficiency at lowest manfacturing cost, the following deposition processes have to be monitored:

Metal grid
Electrodes
Buffer or seed layer
Tunnel oxide
Passivation layer

Testing

Sheet resistance
Conductivity
Thickness
Homogeneity
Defectoscopy

Application

Incoming inspection
Wafer testing
Deposition process control
Quality control
Final inspection

Substrate

n-type Si
p-type Si

Process

Inline
Carrier

Environment

In-vacuo and ex-vacuo
In-situ and ex-situ
Inline and offline

Types

HJT/ HIT
PERC/ PERT
TopCon
IBC
Tandem
Perovskite-HJT-Tandem

Use Case Wafer Incoming Inspection

Wafer incoming inspection for poly or mono Si wafer is dedicated to sheet resistance characterization by means of high frequency eddy current technology. Measurement tasks could be realized by individual sheet resitastance characteriztation or combined with thickness measurement.