EddyCus® ResMapper
Fully Automated Wafer Imaging Device with Automated Cassette Handling System
To Generate High Quality Resistivity Mappings (45 Wafers Per Hour)

The EddyCus® ResMapper is a fully automated wafer imaging device (full-auto type) with automated cassette handling system for full area characterization of wafer substrates or coatings to ensure process reliability and quality assurance, in the semiconductor industry.

The system is equipped with two non-contact eddy current sensors operating in transmission mode. This allows the homogeneity of the substrate material or conductive coating to be displayed in great detail.

Our system is also capable of measuring the 

• Resistivity 0.1 – 100 mOhm·cm,
• Sheet resistance from 0.0001 – 100,000 Ohm/sq,
• Metal layer thickness of a thin film from 2 nm – 1 mm,
• Total thickness variation from 300 – 1,000 µm,
• Bow from ± 1 mm and
• Warpage from ± 1 mm.

Innovative Floating-wafer Technology

During the development of the device, emphasis was placed on reducing contacts of the system with the wafer to a minimum in order not to influence the integrity of the wafer. Therefore, the device works almost completely non-contact. The top and bottom of the wafer substrate or the coating are not touched. Contact is only made selectively and with little force on the side surfaces of the wafer. Please have a look at our video of the EddyCus® ResMapper to understand the handling process.

Wide Range of Measurement Capabilities

The sheet resistance measuring range of the device is between 1 milliohm per square and 100 kiloohm per square (0.0001 – 100,000 Ohm/sq). The wide sheet resistance range results in a metal layer thickness range between 2 nm and 1 mm. Our sheet resistance calculator helps determine whether our device is suitable for your measurement needs.

• Resistivity 0.1 – 100 mOhm·cm,
• Sheet resistance from 0.0001 – 100,000 Ohm/sq,
• Metal layer thickness of a thin film from 2 nm – 1 mm.

It enables the inspection of diverse wafer types and materials, such as silicon or gallium arsenide, across different thicknesses and electrical properties.

Additional Measurement Capabilities

In addition to the sheet resistance, the resulting metal layer thickness and the resistivity, the device is able to detect properties of the wafer substrate using optical sensors. 

• Total thickness variation from 300 – 1,000 µm,
• Bow from ± 1 mm and
• Warpage from ± 1 mm.

With its ability to detect a wide spectrum of defects, from microscopic cracks to film thickness variations, the tool enhances quality control and eliminates the need for multiple tools, simplifying workflows and reducing costs.

High-resolution, Full-surface Wafer Mapping With High Throughput

The measuring device creates a high-resolution, full-area imaging of the wafer or coating, which gives you a deep insight into the quality of the characterized wafer. Depending on the setting and your time requirements, imagings with a few dozen to several tens of thousands of measurement points are possible.

The software also offers various analysis tools, such as a histogram or various line profiles. To view an area on the wafer in particular detail, you can select the relevant location with the selection tool and analyze it again using line profiles or the histogram.

The throughput of the EddyCus® ResMapper is 45 wafers per hour – around 1,000 wafers per day. 

For 150 mm and 200 mm Wafers in Open Cassettes

The fully automated wafer imaging system EddyCus® ResMapper has a loading device that can hold a wafer carrier with 150 mm (6 inch) wafers and 200 mm (8 inch) wafers. The wafer carrier has a capacity of 25 wafers.

Automated Wafer Handling System

For wafer imaging, the wafer is transferred from the cassette to the eddy current sensor and then put back into the cassette. A useful tool for manufacturing businesses looking to cut down on the time spent handling wafers is automated wafer handling. Our automated wafer handling technology lowers labor costs, boosts processing accuracy, and lowers the possibility of human error. Wafers are measured, handled, and transported precisely by the system from the cassette to the measuring station and back to the cassette. By doing this, human manipulation of the wafers is no longer necessary, which prevents measurement errors and potential wafer damage.

Dedicated For Wide Band Gap Materials Such As SiC, GaN

A type of semiconductor material known as a wide band gap material has an energy bandgap that is broader than that of a typical semiconductor. Transistors and other integrated circuits are made using wide band gap materials in the semiconductor sector. These components are crucial for semiconductors because they provide greater power efficiency and quicker switching times. Wide band gap materials are appropriate for high-power applications because they also have larger breakdown voltages. They are better able to withstand radiation, which makes them perfect for use in space applications. Silicon carbide, gallium nitride, and diamond are a few examples of materials with a wide band gap. Many different applications, such as power supply, solar cells, and laser diodes, utilise these materials.

Sheet Resistance, Metal Layer Thickness, Resistivity, TTV, Bow and Warpage All In One Device

The fully automated wafer imaging tool with automated wafer handling system EddyCus® ResMapper is able to determine the

• sheet resistance and
• thickness of a thin film as well as the
• resistivity
• TTV
• Bow
• Warpage of a wafer substrate.

The device has a large measuring range, which means that almost all conceivable applications can be measured by the device.

Small Footprint

The full-auto type device has a footprint of  less than 1200 x 800 mm and therefore fits on a table. The footprint is with 0.93 sqm very small. Since space in the cleanroom is highly limited, every square meter counts. The ResMapper offers the advantage of combining multiple devices into one with its versatile measurement capabilities, saving even more space. This not only saves space, but also money

For more information please watch our data sheet.

Data Sheet for EddyCus® ResMapper