Chamber Integration Kits for Near-process Measurement

Higher Wafer Yield and
Higher Wafer Throughput

Higher Throughput

through increased system up-time

Better Device Performance and Improved Yield

through live improvement of process parameters because of in-chamber testing

Metallization Coater Sensor Integration

• Rotating domes carrying wafers
• In-situ measurement during metal deposition (Ti, Cu, Al, Ag, Au…)
• Measurement during wafer rotation
• Continues measurement with automatic wafer detection

Optical Coater Sensor Integration

• Rotating platform with glass substrates
• In-situ measurement during metal deposition (Ti, Cu, Al, Ag, Au…)
• Measurement during substrate rotation
• Sheet resistance logging over time

Inline Wafer Coater Sensor Integration

• Inline horizontal with glass or wafer substrates
• In-situ measurement during metal deposition (Ti, Cu, Al, Ag, Au…)
• Measurement during substrate rotation
• Sheet resistance logging over time

Cluster Deposition Tool Sensor Integration

• Wafer transfer from cassette to process and analytic chambers
• Wafer/layer characterization in test chamber dedicated to non-contact electrical metrology

Inline S2S Coater in Hot Environment

• Inline horizontal with XXS hot sensor integration
• Distance between the sensor and the substrat is at least 20 mm