Retro-fit Sensor Integration
for
Deposition Cluster Tools
Sheet Resistance · Metal Layer Thickness · Resistivity
- Non-contact real time measurement
- High measurement speed up to 1,000 measurements/ sec.
- Fixed sensor installation or traversing sensor installation
- Line profile before and after deposition
- Process control
Introduction
The EddyCus® inline ICM (interconnection module) is a measuring module that is installed between a coating chamber and the central wafer handling chamber. It consists of two non-contact eddy current Sensor XXS operating in transmission mode and a connection module.
It is dedicated to measure the sheet resistance [Ohm/sq] or metal layer thickness [nm, µm] of an applied layer or the resistivity [mOhm·cm] of the substrate. The software records a line profile that provides an insight into the quality of the coating or substrate. Different designs for common coating chambers such as Endura available.
The interconnection module is typically used for:
- Upgrade of existing deposition systems with measurement capabilities
- Enhanced instant quality control
- Line profile of sheet resistance, metal layer thickness and resistivity
- Predictive maintenance
Sensor Capabilities
- Sheet Resistance [0.01 – 1,000 Ohm/sq]
- Metal Layer Thickness [5 nm – 2 mm]
- Resistivity [0.1 – 100 mOhm·cm]
- Wafer Temperature
Gap Size
5 – 50 mm (depending on wafer handler)
Supported Substrates
150 – 300 mm Wafer
Supported Interfaces
- UDP
- PROFINET
- TDP
- .Net libraries
- Modbus (upcoming)
- EtherCAT (upcoming)
Supported Sizes
- 150 mm
- 200 mm
- 300 mm
Features and Benefits
Enables Measurement on
Process Wafers
Instant Feedback
Within Deposition Chamber
Higher Deposition Quality Through Enhanced Run-to-run-control
Optimize Target Lifetime
Faster Recipe Setting For New Targets / Faster Tool Ramp-up
Higher Throughput
Through Less Test Wafer
Savings Because of No Test Wafers Sample Monitoring
Instant Process Data For Out-of-spec wafer
Available Interfaces
- UDP
- PROFINET
- TDP
- .Net libraries
- Modbus (upcoming)
- EtherCAT (upcoming)
Analyzing Options
- Line profile of sheet resistance, metal layer thickness, resistivity
- Instant deposition data for new material configurations
- Wafer-to-wafer and first wafer effects
- Chamber-to-Chamber effects
- Data for run-to-run control
- Effects of target lifetime
Video of the EddyCus® inline ICM
The video gives you an impression of how to use the interconnection module. Which materials can be analysed and how the device works in general.
Data Table for EddyCus® inline ICM
System Features
| Measurement technology | Non-contact high frequency eddy current sensor |
| Place of measurement | In-vacuo installation between handling area and slit valve |
| Substrates | Wafer, glass, etc. |
| Measurement gap size | 5 – 50 mm (depending on wafer handler) |
| Module sizes | 150 / 200 / 300 mm |
| Conductive layers | Metals, alloys and other conductive layers |
| Environment | In-vacuo @ T up to 220 °C / 428 °F |
| Sample rate | 1 / 10 / 50 / 100 / 1,000 measurements per second for line scan |
| Hardware trigger | 5 / 12 / 24 V |
| Interfaces | UDP, .Net libraries, TCP, Modbus, Profinet, analog/digital |
Measurement Capabilities
| Sheet Resistance Measurement | |
|---|---|
| Sheet resistance measurement range | 0.01 – 1,000 Ohm/sq (depending on the gap size) | Metal Layer Thickness Measurement |
|
Thickness measurement of metal films (e. g. Cu, Al, Ag, Au, Ni, Ti, Ta, Pt, W) |
5 nm – 2 mm (in accordance with sheet resistance) | Resistivity Measurement |
| Thickness measurement range | In accordance with sheet resistance |
Frequently Asked Questions
Sheet resistance, metal layer thickness, resistivity,
