Crystalline Photovoltaic
Different high effiency wafer based cell technologies are available in high volume manufacturing. Manufacturing costs are crucial for cells and modules. For achieving highest efficiency at lowest manfacturing cost, the following deposition processes have to be monitored:
- Metal grid
- Electrodes
- Buffer or seed layer
- Tunnel oxide
- Passivation layer
Testing
- Sheet resistance
- Conductivity
- Thickness
- Homogeneity
- Defectoscopy
Applications
- Incoming inspection
- Wafer testing
- Deposition process control
- Quality control
- Final inspection
Substrates
- n-type Si
- p-type Si
Process
- Inline
- Carrier
Environment
- In-vacuo and ex-vacuo
- In-situ and ex-situ
- Inline and offline
Types
- HJT/ HIT
- PERC/ PERT
- TopCon
- IBC
- Tandem
- Perovskite-HJT-Tandem
Use Case Wafer Incoming Inspection
Wafer incoming inspection for poly or mono Si wafer is dedicated to sheet resistance characterization by means of high frequency eddy current technology. Measurement tasks could be realized by individual sheet resitastance characteriztation or combined with thickness measurement.
Use Case Passivation
Passivation of wafer for minimizing recombination effects can be monitored by inductive methodes such as hogh frequency eddy current technology.
