EddyCus® map 2530 RMT Multi Application Imaging Device –
For High Quality Mappings

The EddyCus® map 2530 RMT for mixed solutions is a bench top scanner particularly suitable for research and technology labs. It is fully functional to measure a bunch of different applications such as solar wafers, printed electronics and carbon fibers. It's a compact device, which can measure samples up to 300 mm (12 inch).

Benefits

  • High resolution images with over 30 000 measurement points within 4 minutes for best defect detection
  • Measurement up to the edge of the sample
  • Various analyzing options such as line profiles or histogram
  • Various sensor options to adjust the device optimal to your measurement task
  • Tension Frame allowes to adapt the sensor z-position to follow the contour of the samples surface

Applications

Datasheets:

Icon EddyCus® map 2530 RMT (1.2 MB)

DISCUSS YOUR MEASUREMENT TASK

Fully automated imaging device with wafer mapping on web interface
Front view of the EddyCus® ResMapper – fully automated wafer mapping device with automated wafer handling system
Side view of the EddyCus® ResMapper – fully automated wafer mapping device with automated wafer handling system
Web interface showing a wafer mapping with line profiles scanned by the EddyCus® ResMapper – fully automated wafer imaging system

 

 

Printed Electronics Application

A visual inspection of printed electronics is not sufficient to ensure their functionality. The EddyCus® map RMT for mixed solutions can assess the integrity of printed electronics and detect inconsistencies—even when, as shown in the two images below, no defects are visible to the naked eye after optical inspection.

EddyCus_map_2530_with_a_printed_electronic.jpg

Example Photo and Corresponding Scan of a Test Structure of Printed Electronics

This example showcases printed electronic test structures alongside high-resolution eddy current mapping performed by the EddyCus® map 2530 RMT for mixed applications.

Example Photo of Printed Device and Eddy Current Scan

This example shows printed devices with defects. The eddy current image was done by high-resolution eddy current mapping device EddyCus® map 2530 RMT for mixed applications.

Example Photo of Printed Fine Structure and Eddy Current Imaging

This examples shows a printed fine structure and its high resolution eddy current scan.

 

 

Solar Wafer Application

The EddyCus® map 2530 RMT for mixed applications imaging device can measure samples with heights of up to 40 mm and a maximum curvature of 10 mm. The device supports sample weights of up to 5 kg (depending on the diameter). If you need to measure heavier samples, please contact us for more information.

  • Solar wafer
  • Thin film pv
  • Crystalline solar cell
Demonstrate the feasibility of eddy current technology in the case of carbon fiber mapping through a demo measurement

Sample Scan of a Crystalline Solar cell

The scan shows the conductive structures of the solar cell.

 

 

EddyEVA Analyzing

The EddyEVA analyzing software allows an in depth analyzing of the integrity of a sample.

Eddy current measurement solutions are suitable for applications along the whole production process

 

 

Easy to Use Software With Various Analyzing Options

The EddyCus® map 2530 RMT for mixed applications has an easy to use software. After you laid your sample central on the measurement field you

  1. Choose your recipe
  2. Press on "Start"
  3. Watch the software creating the map while scan process proceeds

After the scan is finished you can start the analyzing process. You will be able to

  • Draw line profiles
    • predefined line profiles and
    • free drawed line profiles
  • Draw specific areas of interest
    • Rectangle
    • Circle
    • Pen to draw free area
  • Select a histogram

 

 

For more information please watch our data sheet or contact us by email.

Data Sheet for EddyCus® map 2530 RMT

Measurement technology High frequency eddy current sensor
Substrates Solar wafer, carbon, pcb, printed electronics
Max. scanning area 12 inch / 300 mm x 300 mm
Edge effect correction / exclusion 2 – 10 mm (depending on size, range, setup and requirements)
Max. sample thickness / sensor gap 40 mm
Conductivity range 0.0005 – 100 Ohm/sq
Resistivity range 0.1 – 1,000 mOhm·cm
Conductivity range 0.01 – 65 MS/m
Pitch 0.1 – 10 mm
Accuracy 1 – 3 %
Repeatability 0.5 – 1.5 %
Spot size (coil size)
Penetration depth (frequency)		 1 – 9 mm (depending on coil size)
1 – 10 mm (depending on frequency)
Speed 150 mm per second (time 1 to 30 minutes)
Device dimensions (w/h/d) / weight 31.5” x 19.1” x 33.5” / 785 mm x 486 mm x 850 mm / 90 kg
Further available features Sheet resistance imaging, metal layer thickness imaging,
advanced impedance spectroscopy using EddyEVA

Contact

For product requests contact us by using the

For a prompt and informative response, please describe your measurement task (material, sample dimensions, expected measurement range) and provide your phone number.

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