SURAGUS Logo colored with transparent background

sp table

SURAGUS Product Overview SURAGUS Product Overview Non-contact eddy current measurement systems for sheet resistance, layer thickness, resistivity, and further electrical parameters – from handheld devices to full inline integration. Single Point – Handheld & Benchtop ‹ › Handheld EddyCus® Portable Portable handheld device for non-contact sheet resistance measurement directly on-site. Instant results on the integrated […]

Displacement Measurement

Displacement Measurement: The Complete Guide to Eddy Current and Capacitive Sensors Displacement measurement is the process of determining the distance, position, or movement between a sensor and a target object. Modern industrial applications demand measurement accuracy in the micrometer or nanometer range – a challenge that only specialized non-contact sensors can meet. This guide explains […]

Parameter Matrix

Parameters We Measure Our precision instruments cover a comprehensive range of measurement parameters for industrial applications. Sheet Resistance 8 µΩ/sq – 300,000 Ω/sq Metal Layer Thickness 1 nm – 2 mm Resistivity 1 – 3,000 mΩ·cm Electrical Anisotropy 0.33 – 3 MD/TD Emissivity 0.003 – 0.5 Areal Weight 1 – 100 g/m² Defects & Geometry […]

Product Matrix

Overview of SURAGUS Products Single Point Measurement Solutions EddyCus® Portable Handheld for quick checks of flat materials  EddyCus® Portable PS Handheld with external sensor for quick checks of bulk materials or curved surfaces EddyCus® lab 2020 TM Benchtop for flat materials such as foils, wafer or glass EddyCus® lab 2020 RMB Benchtop for bulk materials […]

Thickness Measurement for Feed Forward Etch Process Control

Inline Thickness Measurement for Feed-Forward Etch Process Control Enabling Sub-Nanometer CD Uniformity Through Pre-Etch Film Characterization As semiconductor devices continue to scale toward atomic dimensions, the margin for process variation has shrunk dramatically. At the 5 nm technology node, allowable critical dimension (CD) variation across the wafer is less than 0.5 nm—equivalent to just two […]

CMP Process Monitoring and Endpoint Detection

CMP Process Monitoring and Endpoint Detection Enabling Real Time Metal Film Thickness Measurement for Precision Planarization Control Chemical Mechanical Planarization (CMP) is an indispensable process in modern semiconductor manufacturing, enabling the global planarization required for multilevel interconnect structures at advanced technology nodes.As device geometries shrink below 10 nm and interconnect layers exceed 20 levels, precise […]

EddyCus® map IK

Non-contact Eddy Current Mapping Integration Kit for Sheet Resistance, Film Thickness and Resistivity Imaging Modular Sensor mapping integration kit to generate metal thinfilm thickness, sheet resistance or resistivity images of wafers, pucks and boules High resolution images with up to 70,000 measurement points (300 mm @ 1 mm pitch) Up to 40 wafers per hour […]

EddyCus® inline SLIM

EddyCus® inline SLIM – Smart Link Integrated Module Use existing gates and link transfers: equip them with a measurement add-on to generate early-stage measurement data. Non-contact and non-destructive Near-process monitoring High-speed and accurate High repeatability and long term stability Test directly on product wafers Easy integration into tools Send a Request Request Demo Measurement Eddy […]