WLP/PLP

Advanced Packaging Wafer and Panel Level Packaging (WLP, PLP) With International Technology Roadmap for Semiconductors (ITRS) retiring and International Roadmap for Devices and Systems (IRDS) taking over charge to roadmap the present and future technologies for the next 15 years, there is greater focus to look far more than Beyond CMOS. The introduction of Hetergenous […]

Boule and Ingot Characterization

Boule and Ingot Characterization Boule, crystal or ingot growth is crucial for excellent semiconductor applications, e.g. in light to defects, dislocations and grain boundaries. Beside state of the art processes such as Czochralski method, there are alternative technologies for crystal growth, e.g. from gaseous or liquid phase. To maintain and increase cost-efficiency high frequency eddy […]

Wafer Characterization

Wafer Characterization Semiconductor wafer substrates must meet strict specifications for resistivity, homogeneity, and structural integrity before they enter device fabrication. High-frequency eddy current technology provides a fast, contact-free method for characterizing bare and processed wafers — delivering the data needed to qualify incoming material, monitor crystal growth and wafering processes, and ensure substrate quality at […]