EddyCus® map IK

Non-contact Eddy Current Mapping Integration Kit for Sheet Resistance, Film Thickness and Resistivity Imaging Modular Sensor mapping integration kit to generate metal thinfilm thickness, sheet resistance or resistivity images of wafers, pucks and boules High resolution images with up to 70,000 measurement points (300 mm @ 1 mm pitch) Up to 40 wafers per hour […]

EddyCus® inline SLIM

EddyCus® inline SLIM – Smart Link Integrated Module Use existing gates and link transfers: equip them with a measurement add-on to generate early-stage measurement data. Non-contact and non-destructive Near-process monitoring High-speed and accurate High repeatability and long term stability Test directly on product wafers Easy integration into tools Send a Request Request Demo Measurement Eddy […]

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EddyCus® inline MCM

Measurement Chamber Addonfor Deposition Cluster Tools Higher Thin-film and substrate quality through fast and precise Near-process Measurement based on non-contact eddy current technology. Record a Line Profile of the wafer and thin-film. Test directly on product wafers Easy integration into tools Non-contact real time measurement Near-process monitoring High-speed and accurate High repeatability and long term […]

EddyCus® inline ICM

Retro-fit Sensor Integrationfor Deposition Cluster Tools Higher Thin-film quality through fast and precise Near-process Measurement based on non-contact eddy current technology. Record a line profile for each wafer before and after deposition.Sheet Resistance · Metal Layer Thickness · Resistivity Non-contact real time measurement High measurement speed up to 1,000 measurements/ sec. Fixed sensor installation or […]