Chamber Integration Kits for Near-process Measurement
Higher Throughput and higher yield through electrical characterization of wafers and Metal Layers
- Non-contact measurement
- Highly flexible
- Ex-vacuo, in-vacuo, ATEX and high temperature variants
Higher Wafer Yield and Higher Wafer Throughput
through high-speed measurements
because of no contact to layers
Higher Throughput
through increased system up-time
Better Device Performance and Improved Yield
through live improvement of process parameters because of in-chamber testing
Metallization Coater Sensor Integration
- Rotating domes carrying wafers
- In-situ measurement during metal deposition (Ti, Cu, Al, Ag, Au…)
- Measurement during wafer rotation
- Continues measurement with automatic wafer detection
Optical Coater Sensor Integration
- Rotating platform with glass substrates
- In-situ measurement during metal deposition (Ti, Cu, Al, Ag, Au…)
- Measurement during substrate rotation
- Sheet resistance logging over time
Inline Wafer Coater Sensor Integration
- Inline horizontal with glass or wafer substrates
In-situ measurement during metal deposition (Ti, Cu, Al, Ag, Au…) - Measurement during substrate rotation
- Sheet resistance logging over time
Cluster Deposition Tool Sensor Integration
- Wafer transfer from cassette to process and analytic chambers
- Wafer/layer characterization in test chamber dedicated to non-contact electrical metrology
Inline S2S Coater in Hot Environment
- Inline horizontal with XXS hot sensor integration
- Distance between the sensor and the substrat is at least 20 mm
