Measurement Solutions for Semiconductors

Process Monitoring

  • Deposition (PVD, CVD, etc.)
  • Etching / Polishing
  • Annealing / Tempering
  • Doping / Implantation
  • Defect monitoring

Measurements

  • Sheet Resistance [Ohm/sq]
  • Metal Layer Thickness [nm, µm]
  • Resistivity [Ohm·cm]

Benefits

  • Non-Contact
  • High Sample Rate
  • Imaging Solution

Setups

  • Benchtop Tools
  • Tool Integration
  • C2C Tools

Solutions

Single Point

EddyCus® lab Series

Imaging

EddyCus® map Series

Full-auto Imaging

EddyCus® ResMapper Series

Tool Integration

EddyCus® inline Sensor Series

Results

2DEG Material Imaging

Metal Nitride Imaging

Metal Thickness Imaging

Ingot / Boule Imaging

Wafer Characterization

Thin-film Characterization

Puck Characterization

Boule Characterization

Single Point Solutions

  • Wafer

Mapping Solutions

  • SiC-Wafer Resistivity Homogeneity
  • Si-Wafer Resistivity Homogeneity
  • GaN-Wafer Resistivity Homogeneity
  • GaAs-Wafer Resistivity Homogeneity
  • Wafer Metallization Thickness Homogeneity
  • Wafer Metallization Sheet Resistance Homogeneity
  • Puck Slicing Quality
  • Boules Crack and Defect Detection
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Please contact our sales team.