SURAGUS Product Overview
Non-contact eddy current measurement systems for sheet resistance, layer thickness, resistivity, and further electrical parameters – from handheld devices to full inline integration.
Single Point – Handheld & Benchtop
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Handheld
EddyCus® PortablePortable handheld device for non-contact sheet resistance measurement directly on-site. Instant results on the integrated touch display. Suitable for quality checks after manufacturing or incoming goods inspection. Sheet Resistance Non-Contact Layer Thickness Emissivity |
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Handheld
EddyCus® Portable PSHandheld device for pastes & slurries. Non-contact measurement of electrical properties directly on paste-like materials such as battery electrode slurries. Pastes & Slurries Portable Battery |
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Benchtop
EddyCus® lab 2020 TMBenchtop lab instrument for precise layer thickness and sheet resistance measurements on wafers, foils, and coated substrates. Sheet Resistance Layer Thickness Lab |
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Benchtop
EddyCus® lab 2020 RMB – Pucks & BoulesDedicated solution for resistivity measurement on SiC pucks and boules. Non-contact and non-destructive characterization. Resistivity SiC Boules |
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Benchtop
EddyCus® lab 2020 RMB – Slurry & PasteBenchtop solution for quality control of slurries and pastes, e.g. in battery electrode production. Slurry Paste Battery |
Imaging & Mapping
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Semi-Automated
EddyCus® map 2530 TM – Wafer & MetallizationsFull-area sheet resistance and thickness measurement with mapping for wafers and metallized substrates. Measurement pitch from 100 µm to 10 mm. Wafer Mapping Sheet Resistance |
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Semi-Automated
EddyCus® map 2530 RMB – PucksResistivity mapping for SiC pucks. Full-area visualization of material homogeneity. SiC Pucks Resistivity |
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Semi-Automated
EddyCus® map 2530 RMB – Wafer & MetallizationsNon-contact resistivity mapping for wafers and metallized surfaces. Wafer Resistivity |
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Semi-Automated
EddyCus® map 2530 RMT – BoulesMapping system for resistivity characterization of SiC boules and ingots. Boules Ingots |
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Semi-Automated
EddyCus® map 2530 RMT – Flat & Curved SamplesFlexible mapping solution for flat and curved samples of varying geometry. Flexible Samples Mixed Solutions |
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Fully Automated
EddyCus® ResMapperFully automated resistivity mapping system with cassette handling for high-throughput semiconductor manufacturing. Up to 45 wafers/hour, footprint < 1 m². Automated High Throughput Semiconductor |
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Integration Kit
EddyCus® map IKMapping integration kit for embedding eddy current measurement technology into existing inspection systems and setups. OEM Integration |
Inline – Production Integration
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R2R / S2S / W2W
EddyCus® inlineInline eddy current sensor for roll-to-roll, sheet-to-sheet, and wafer-to-wafer processes. Real-time quality control with up to 1,000 measurements/sec. R2R Real-Time Sheet Resistance |
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R2R / S2S
EddyCus® inline SensorlineMulti-channel sensor line with stackable 8-sensor modules for full-width inline measurement. Up to 128 measurement lanes. Multi-Sensor Full Width Up to 128 Lanes |
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Cables / Wires / Tubes
EddyCus® inline RSRotationally symmetric inline sensor for quality inspection of cables, wires, and tubes. Rotationally Symmetric Defect Detection |
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Pastes & Slurries
EddyCus® inline RS – Pastes & SlurriesInline monitoring of paste quality during production, e.g. for battery electrode manufacturing. Slurry Battery Inline QC |
Vacuum & Near-Process Solutions
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Cluster Tool
EddyCus® inline ICMIntegrated cluster module for in-situ layer thickness and resistance measurement in vacuum equipment. In-Situ Vacuum |
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Cluster Tool
EddyCus® inline MCMMulti-channel module for parallel measurements in high-throughput vacuum processes. Multi-Channel High Throughput |
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Cluster Tool
EddyCus® inline SLIMCompact slim sensor for space-critical vacuum integrations with minimal footprint. Compact Slim Design |