Measurement Chamber Addon
for Deposition Cluster Tools
Higher Thin-film and substrate quality through fast and precise Near-process Measurement
based on non-contact eddy current technology.
Record a Line Profile of the wafer and thin-film.
- Test directly on product wafers
- Easy integration into tools
- Non-contact real time measurement
- Near-process monitoring
- High-speed and accurate
- High repeatability and long term stability
Introduction
The EddyCus® inline MCM is a metrologoy chamber module for wafer deposition cluster tools. It consists of two non-contact eddy current Semi-Vac Sensors operating in transmission mode with only the tip is inside the vacuum and the chamber with SEMI conform connection to the handling chamber.
It is dedicated to measure the sheet resistance [Ohm/sq] or metal layer thickness [nm, µm] of an applied layer or the resistivity [mOhm·cm] of the substrate.
The software records a line profile that provides an insight into the quality of the coating or substrate. Different designs for common coating machines such as Endura available.
The interconnection module is typically used for:
- Upgrade of existing deposition systems with measurement capabilities
- Enhanced instant quality control
- Line profile of sheet resistance, metal layer thickness and resistivity
Sensor Capabilities
- Sheet Resistance [0.001 – 1,000 Ohm/sq]
- Metal Layer Thickness [1 nm – 2 mm]
- Resistivity [in accordance with sheet resistance]
Supported Substrates
Wafer, Glass, etc. with 150 / 200 / 300 mm diameter
Optional Temperature Sensor
Features and Benefits
Measurement on
Process Wafers
Optimize Process Parameters on the Fly
Improve Device Performance
Early Sorting Out of Misprocessed, Inhomogeneous Wafers
Reduce System Downtime
Higher Wafer Throughput
Reduce Coating Cost per Wafer
Process Qualification Measurement
Interfaces
- OpenAPI / HTTP (Rest API) – integrable with ASUconnect
- Anybus interface modules
- UDP
- PROFINET
- Modbus/TCP (on request)
- EtherCAT (future feature)
- Ethernet/IP (future feature)
- IO module
- 2x trigger channels (2 axis) + 1x reset per channel
- Options with 5 V DC or 24 V DC input
- 500 Hz input (3000 Hz on request)
- Optional: Trigger output 4..20 mA and 0..10 V
Video of the EddyCus® inline MCM
The video gives you an impression of how the measurement chamber module works.
Data Table for EddyCus® inline MCM
System Features
| Measurement technology | Non-contact high frequency eddy current sensor |
| Place of measurement | In-vacuo in dedicated metrology chamber |
| Substrates | Wafer, glass, etc. |
| Measurement gap size | 5 – 50 mm (depending on wafer handler) |
| Substrate sizes | 150 / 200 / 300 mm (different sizes of MCM are available) |
| Conductive layers | Metals, alloys and other conductive layers |
| Measurement types | Sheet resistance, metal thickness, resistivity, wafer temperature |
| Environment | In-vacuo, wafer temperature up to 500 °C / 932 °F |
| Sample rate | 1 / 10 / 50 / 100 / 1,000 measurements per second |
| Hardware trigger | 5 / 12 / 24 V |
Measurement Capabilities
| Sheet Resistance Measurement | |
|---|---|
| Sheet resistance measurement range | 0.001 – 1,000 Ohm/sq | Metal Layer Thickness Measurement |
| Metal layer thickness range (e.g. Cu, Al, Ag, Au, Ni, Ti, Ta, Pt, W) |
1 nm – 2 mm (in accordance with sheet resistance) Metal layer thickness measurement by conversion or direct calibration (both software supported) |
Resistivity Measurement |
| Resistivity measurement range | Resistivity measurement by conversion or direct calibration (both software supported) | Emissivity Measurement |
| Emissivity measurement range | Emissivity measurement by conversion |
Frequently Asked Questions
Sheet resistance, metal layer thickness, resistivity,
