Measurement Solutions for the Solar Industry
Process Monitoring
- Incoming silicon wafer inspection
- Deposition (PVD, CVD, etc.)
- Etching / polishing
- Doping
- Wet-processing
Measurements
- Sheet resistance [Ω/□]
- Metal layer thickness [nm, µm]
- Resistivity [Ohm·cm]
- PN junction integrity testing
Applications
- Wafer resistivity monitoring
- Sheet resistance monitoring of conductive layers (ITO at HJT)
- Metal layer thickness and sheet resistance of
non-transparent (back) contacts (metals) setups
Solutions
Single Point
EddyCus® lab Series
Imaging
EddyCus® map Series
Inline
EddyCus® inline Series
Inline
EddyCus® inline Series
Results
P-doped Monocrystalline Silicon Wafer
Line Profile Analysis Exposes Homogeneity
